Description: QFP-208, 3DFXFeatures: 208-pin lead frame package 0.5mm lead pitch 0.8mm body thickness Lead-free package Compatible with lead-free reflow soldering RoHS compliantApplication: This 3DFX QFP-208 package is used in a variety of applications, including consumer electronics, automotive, and industrial electronics. It is suitable for high-speed data transmission and signal processing.(For reference only)
https://www.utsource.net/itm/p/774405.html